Samsung develops new HBM3E 12H chip with record capacity to boost AI power
Samsung Electronics has announced a new high-bandwidth memory chip that has the “highest capacity” in the industry. The South Korean giant claims that the HBM3E 12H “increases productivity by more than 50%.” AI service providers are increasingly requiring HBMs with higher capacity, and our new HBM3E 12H product was developed to meet this need. This […]